描述
  • USAGE TO MOBILE COMMUNICATION
     speaker adhesion and embedment  Camera module adhesion  FPC(Flexible PCB) adhesion  Mainboard bottom filling  Frame adhesion  Fingerprint key module adhesion  Sensor control unit adhesion  Power pack embedment
  • USAGE TO AUTOMOTIVE ELECTRONICS
     Micro motor sealing and lubrication  Speaker adhesion and embedment  Instrument panel adhesion and embedment  ECU sealing and heat-conducting  Tow encapsulation  Battery core adhesion  Inverter embedment  Sensor sealing
  • USAGE TO THE PCB INDUSTRY
     Pin protection  Dam filling  Bottom filling  Silica coating